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High Speed Copper Plating Chemicals CuSO4 Electroplating

High Speed Copper Plating Chemicals CuSO4 Electroplating

Produk - Copper Plating Chemicals
  • Menyoroti

    CuSO4 Copper Plating Chemicals

    ,

    High Speed CuSO4 Electroplating

    ,

    Copper CuSO4 Electroplating

  • Jenis
    Pencerah
  • barang
    bahan pembantu kimia
  • Menggunakan
    Pelapisan Tembaga
  • Fitur
    Kecepatan Tinggi
  • Ciri
    Bebas sianida
  • Tempat asal
    Cina
  • Nama merek
    FENGFAN
  • Nomor model
    FI-7359
  • Kuantitas min Order
    Bisa dinegosiasikan
  • Harga
    dapat dinegosiasikan
  • Kemasan rincian
    Kemasan standar ekspor
  • Waktu pengiriman
    15-25 hari kerja
  • Syarat-syarat pembayaran
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Menyediakan kemampuan
    200000pcs/hari

High Speed Copper Plating Chemicals CuSO4 Electroplating

  • High Speed Copper Plating Chemicals CuSO4 Electroplating
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High speed Copper Plating CuSO4 Electroplating

 

Product Details

 

High current density, fast deposition speed, The coating has bright and good ductility, and the plating solution is stable.

Mainly suitable for coil-to-roll and spray plating.

 

Process Specification Conditions

 

CuSO4·5H2O 250～350g/L
H2SO4 35~55ml/L
FI-7359 8~20ml/L
Cl- 60~100ppm
Temp. 35~50℃
Current density 20~50 A/dm2
Tag:

copper electroplating brightener

copper plating brightener

copper plating additives

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